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According to reports, the project uses the silicon oxide insulating layer in the semiconductor chip process as the polishing object to carry out research work on cerium oxide-based rare earth polishing liquid. The main research objective is to prepare a cerium oxide-based polishing liquid that satisfies the polishing requirements of integrated circuit chips. The preparation of the polishing solution needs to break through the following three technologies: abrasive manufacturing technology, abrasive dispersion technology and polishing liquid formulation technology.
It is understood that the polishing fluids used in the production of integrated circuits in China are all imported, and there is almost no production in China. The price of imported polishing liquid is very expensive in China, which increases the production cost of the chip. The rare earth polishing fluid to be developed by the project can replace some foreign products, reduce the market price, thereby reducing the manufacturing cost of the chip and improving the competitiveness of the semiconductor manufacturing industry in China.
Chemical mechanical polishing is a new technology in the manufacturing process of ultra-large scale integrated circuits. In recent years, with the development of new fields such as ultra-precision optical components, the requirements for high-purity and ultra-fine rare earth cerium oxide polishing powders have gradually increased. The amount is also increasing rapidly.
China's research on semiconductor rare earth polishing fluid
The reporter learned from the Baotou Science and Technology Bureau on July 4 that the Baotou Rare Earth Research Institute recently signed a cooperation agreement with Baotou Tianjiao Qingmei Rare Earth Polishing Powder Co., Ltd. for the research project of new semiconductor polishing liquid of cerium oxide, marking the development of chemical mechanical polishing technology in China. The field has taken a critical step.