Precision laser processing machine and its application examples

Laser processing machines are being developed from the field of ordinary thin metal sheets to precision machining and non-metal processing. Due to the improvement of the laser processing machine itself, as well as the control performance, processing technology and advancement of the laser generator (short-wave laser output power, large output power, etc.), laser processing is expanding to a wider field. In recent years, due to the rapid development of the IT industry and the increasing demand for processing of new materials and special materials, the market demand for laser processing for ultra-precision machining is expanding.

Japan Shibuya Industrial Co., Ltd. has a history of producing and selling laser processing machines for about 30 years. It can not only produce general-purpose models, but also customize processing systems and station processing systems on the assembly line according to customer needs. This article combines several typical products of the company to introduce the precision laser processing machine and its application examples.

Products for ultra-precision machining

(1) LAMICS laser-waterjet compound processing system

Shibuya Industrial Co., Ltd. is the only manufacturer in Japan that produces both laser processing machines and waterjet processing machines. The LAMICS (Laser Aqua-Jet Micro-Cutting System) system is the first composite processing system in Japan that combines these two technologies. The system ejects a filament-like high-pressure water flow through the nozzle (the spray water itself has no cutting ability), and the laser is introduced into the water, and the laser is used for cutting.

The system has the following features:

1 Since the water jet is cooled while laser cutting, the parts are not affected by heat and oxidation during the entire process.

2 It can prevent environmental pollution and burrs caused by molten powder during cutting.

3 Various brittle materials can be cut without cracks.

4 Since the laser can form a total reflection in the water, it does not necessarily need to coincide with the focus.

5 The width of the slit is very narrow, and the section is hardly inclined.

During processing, lasers of different wavelengths can be selected according to the processing object, such as fiber laser (wavelength 1080 nm), green laser (wavelength 532 nm), UV laser (wavelength 355 nm), and the like. The system is mainly suitable for cutting and processing silicon wafers, films, sapphire bottom plates, copper plate grooves, etc., as well as removing various types of processing such as rust spots and plating layers. This type of processing is very effective for dry laser machining in which some workpiece materials are inevitably generated with high heat.

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